Deepcool Z9 High Performance Thermal Paste with 20% Silver Oxide Compounds
This Deepcool thermal paste has thermally conductive compounds that are grease-like silicone materials, filled with 20% heat conductive silver oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
- Suitable for CPU, chipsets on Mainboard, Graphics card, etc.
- Easy to use.
- Wide range of application temperatures.
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